Probe #e6c4aaa3d8 of HONOR BOHK-WAX9X

Log: dmidecode

# dmidecode 3.3 Getting SMBIOS data from sysfs. SMBIOS 3.11.1 present. # SMBIOS implementations newer than version 3.3.0 are not # fully supported by this version of dmidecode. Table at 0xAE2DD000. Handle 0x0000, DMI type 0, 26 bytes BIOS Information Vendor: HONOR Version: 3.07 Release Date: 09/14/2021 Address: 0xE0000 Runtime Size: 128 kB ROM Size: 8 MB Characteristics: PCI is supported PNP is supported BIOS is upgradeable BIOS shadowing is allowed Boot from CD is supported Selectable boot is supported EDD is supported ACPI is supported USB legacy is supported Smart battery is supported BIOS boot specification is supported Targeted content distribution is supported UEFI is supported BIOS Revision: 3.7 Firmware Revision: 3.7 Handle 0x0001, DMI type 1, 27 bytes System Information Manufacturer: HONOR Product Name: BOHK-WAX9X Version: M1030 Serial Number: -- UUID: -- Wake-up Type: Power Switch SKU Number: C171 Family: HONOR MagicBook Handle 0x0002, DMI type 2, 15 bytes Base Board Information Manufacturer: HONOR Product Name: BOHK-WAX9X-PCB Version: M1030 Serial Number: -- Asset Tag: -- Features: Board is a hosting board Board is replaceable Location In Chassis: NULL Chassis Handle: 0x0003 Type: Motherboard Contained Object Handles: 0 Handle 0x0003, DMI type 3, 23 bytes Chassis Information Manufacturer: HONOR Type: Notebook Lock: Not Present Version: M1030 Serial Number: -- Asset Tag: -- Boot-up State: Safe Power Supply State: Safe Thermal State: Safe Security Status: None OEM Information: 0x00000000 Height: Unspecified Number Of Power Cords: 1 Contained Elements: 0 SKU Number: BohrKR-WAP9AHNRP Handle 0x0004, DMI type 4, 48 bytes Processor Information Socket Designation: FP5 Type: Central Processor Family: Zen Manufacturer: Advanced Micro Devices, Inc. ID: 81 0F 81 00 FF FB 8B 17 Signature: Family 23, Model 24, Stepping 1 Flags: FPU (Floating-point unit on-chip) VME (Virtual mode extension) DE (Debugging extension) PSE (Page size extension) TSC (Time stamp counter) MSR (Model specific registers) PAE (Physical address extension) MCE (Machine check exception) CX8 (CMPXCHG8 instruction supported) APIC (On-chip APIC hardware supported) SEP (Fast system call) MTRR (Memory type range registers) PGE (Page global enable) MCA (Machine check architecture) CMOV (Conditional move instruction supported) PAT (Page attribute table) PSE-36 (36-bit page size extension) CLFSH (CLFLUSH instruction supported) MMX (MMX technology supported) FXSR (FXSAVE and FXSTOR instructions supported) SSE (Streaming SIMD extensions) SSE2 (Streaming SIMD extensions 2) HTT (Multi-threading) Version: AMD Ryzen 7 3700U with Radeon Vega Mobile Gfx Voltage: 1.2 V External Clock: 100 MHz Max Speed: 4000 MHz Current Speed: 2300 MHz Status: Populated, Enabled Upgrade: None L1 Cache Handle: 0x0005 L2 Cache Handle: 0x0006 L3 Cache Handle: 0x0007 Serial Number: -- Asset Tag: -- Part Number: NULL Core Count: 4 Core Enabled: 4 Thread Count: 8 Characteristics: 64-bit capable Multi-Core Hardware Thread Execute Protection Enhanced Virtualization Power/Performance Control Handle 0x0005, DMI type 7, 27 bytes Cache Information Socket Designation: L1 - Cache Configuration: Enabled, Not Socketed, Level 1 Operational Mode: Write Back Location: Internal Installed Size: 384 kB Maximum Size: 384 kB Supported SRAM Types: Pipeline Burst Installed SRAM Type: Pipeline Burst Speed: 1 ns Error Correction Type: Multi-bit ECC System Type: Unified Associativity: 8-way Set-associative Handle 0x0006, DMI type 7, 27 bytes Cache Information Socket Designation: L2 - Cache Configuration: Enabled, Not Socketed, Level 2 Operational Mode: Write Back Location: Internal Installed Size: 2 MB Maximum Size: 2 MB Supported SRAM Types: Pipeline Burst Installed SRAM Type: Pipeline Burst Speed: 1 ns Error Correction Type: Multi-bit ECC System Type: Unified Associativity: 8-way Set-associative Handle 0x0007, DMI type 7, 27 bytes Cache Information Socket Designation: L3 - Cache Configuration: Enabled, Not Socketed, Level 3 Operational Mode: Write Back Location: Internal Installed Size: 4 MB Maximum Size: 4 MB Supported SRAM Types: Pipeline Burst Installed SRAM Type: Pipeline Burst Speed: 1 ns Error Correction Type: Multi-bit ECC System Type: Unified Associativity: 16-way Set-associative Handle 0x0008, DMI type 9, 17 bytes System Slot Information Designation: PCI-1 Type: x1 PCI Express x1 Current Usage: In Use Length: Other ID: 1 Characteristics: PME signal is supported Hot-plug devices are supported Bus Address: 0000:01:00.0 Handle 0x0009, DMI type 9, 17 bytes System Slot Information Designation: PCI-2 Type: x4 PCI Express 3 x4 Current Usage: In Use Length: Other ID: 2 Characteristics: PME signal is supported Hot-plug devices are supported Bus Address: 0000:02:00.0 Handle 0x000A, DMI type 11, 5 bytes OEM Strings String 1: $HUA001RU30000 String 2: OemString2 String 3: OemString3 String 4: OemString4 Handle 0x000B, DMI type 13, 22 bytes BIOS Language Information Language Description Format: Long Installable Languages: 2 zh|CN|unicode,0 en|US|iso8859-1,0 Currently Installed Language: en|US|iso8859-1,0 Handle 0x000C, DMI type 16, 23 bytes Physical Memory Array Location: System Board Or Motherboard Use: System Memory Error Correction Type: None Maximum Capacity: 64 GB Error Information Handle: Not Provided Number Of Devices: 2 Handle 0x000D, DMI type 17, 40 bytes Memory Device Array Handle: 0x000C Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 8 GB Form Factor: Row Of Chips Set: None Locator: DIMM 0 Bank Locator: P0 CHANNEL A Type: DDR4 Type Detail: Synchronous Unbuffered (Unregistered) Speed: 2667 MT/s Manufacturer: Hynix Serial Number: -- Asset Tag: -- Part Number: HMAA1GS6CMR6N-VK Rank: 1 Configured Memory Speed: 2400 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Handle 0x000E, DMI type 17, 40 bytes Memory Device Array Handle: 0x000C Error Information Handle: Not Provided Total Width: 64 bits Data Width: 64 bits Size: 8 GB Form Factor: Row Of Chips Set: None Locator: DIMM 0 Bank Locator: P0 CHANNEL B Type: DDR4 Type Detail: Synchronous Unbuffered (Unregistered) Speed: 2667 MT/s Manufacturer: Hynix Serial Number: -- Asset Tag: -- Part Number: HMAA1GS6CMR6N-VK Rank: 1 Configured Memory Speed: 2400 MT/s Minimum Voltage: 1.2 V Maximum Voltage: 1.2 V Configured Voltage: 1.2 V Handle 0x000F, DMI type 18, 23 bytes 32-bit Memory Error Information Type: OK Granularity: Unknown Operation: Unknown Vendor Syndrome: Unknown Memory Array Address: Unknown Device Address: Unknown Resolution: Unknown Handle 0x0010, DMI type 18, 23 bytes 32-bit Memory Error Information Type: OK Granularity: Unknown Operation: Unknown Vendor Syndrome: Unknown Memory Array Address: Unknown Device Address: Unknown Resolution: Unknown Handle 0x0011, DMI type 18, 23 bytes 32-bit Memory Error Information Type: OK Granularity: Unknown Operation: Unknown Vendor Syndrome: Unknown Memory Array Address: Unknown Device Address: Unknown Resolution: Unknown Handle 0x0012, DMI type 19, 31 bytes Memory Array Mapped Address Starting Address: 0x00000000000 Ending Address: 0x003FFFFFFFF Range Size: 16 GB Physical Array Handle: 0x000C Partition Width: 2 Handle 0x0013, DMI type 20, 35 bytes Memory Device Mapped Address Starting Address: 0x00000000000 Ending Address: 0x003FFFFFFFF Range Size: 16 GB Physical Device Handle: 0x000D Memory Array Mapped Address Handle: 0x0012 Partition Row Position: Unknown Interleave Position: Unknown Interleaved Data Depth: Unknown Handle 0x0014, DMI type 20, 35 bytes Memory Device Mapped Address Starting Address: 0x00000000000 Ending Address: 0x003FFFFFFFF Range Size: 16 GB Physical Device Handle: 0x000E Memory Array Mapped Address Handle: 0x0012 Partition Row Position: Unknown Interleave Position: Unknown Interleaved Data Depth: Unknown Handle 0x0015, DMI type 21, 7 bytes Built-in Pointing Device Type: Touch Pad Interface: Other Buttons: 2 Handle 0x0016, DMI type 22, 26 bytes Portable Battery Location: Rear cover inside Manufacturer: Desay Manufacture Date: 1/5/2021 Serial Number: -- Name: HB4792J5ECW-31 Chemistry: Lithium Ion Design Capacity: 0 mWh Design Voltage: 11460 mV SBDS Version: Not Specified Maximum Error: 9% OEM-specific Information: 0x00000048 Handle 0x0017, DMI type 43, 31 bytes TPM Device Vendor ID: AMD Specification Version: 2.0 Firmware Revision: 3.34 Description: TPM Device Characteristics: TPM Device characteristics not supported OEM-specific Information: 0x00000000 Handle 0xFEFF, DMI type 127, 4 bytes End Of Table


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